Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories

Product Details
Customization: Available
CAS No.: 2921199090
Formula: Inapplicability
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  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
  • Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
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Basic Info.

Model NO.
SPR-1210P
Color
Can Be Selected From The Color Card
Appearance
Liquid
Main Raw Material
Epoxy
Method
Brush
Level
Primer+Middle+Topcoat
Drying Method
Drying
Certification
ISO14001, CCC, RoHS, ISO9001
Substrate
Epoxy Resin
Components
Epoxy Resin
Formation Mechanism
Conversion Type
Wear-Resistant
High
Dust-Proof
High
Chemical-Resistant
High
Anti-Slip
High
Period of Service
Long
Easy to Clean
High
Transport Package
Box
Specification
30KG(25KG+5KG)
Trademark
SPR
Origin
Nanxiong China
HS Code
2921199090
Production Capacity
100000

Product Description

Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
 
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories


 

Hard Waterborne Epoxy Resin Self-Leveling Floor System for Electronic Manufacturing Facilities

Product Overview
The EcoGuard Conductive Shield Waterborne Epoxy Self-Leveling Floor is a cutting-edge, solvent-free flooring solution engineered specifically for electronic factories, cleanrooms, semiconductor assembly areas, and ESD-sensitive production zones. Combining a water-dispersed epoxy resin (Component A) and a polyamide-cured hardener (Component B), this system delivers a seamless, ultra-durable surface with exceptional electrostatic dissipative (ESD) properties, chemical resistance, and low-VOC emissions. Formulated to meet the stringent demands of electronics manufacturing-where dust, static, and chemical spills threaten product integrity-this coating adheres to IPC-A-610, MIL-STD-1686, and SEMI F57 standards while offering a sustainable alternative to traditional solvent-based epoxies.

Key Features & Technical Advantages

  1. ESD-Safe & Static-Dissipative Performance
    • Surface Resistivity: 10-10 Ω (measured per ANSI/ESD STM7.1), ensuring safe dissipation of static charges to ground.
    • Point-to-Point Resistance: <1.0 × 10 Ω (per EIA/JEDEC JS-001), preventing electrostatic discharge (ESD) damage to sensitive components.
    • Permanent Conductivity: Embedded carbon nanotube (CNT) or silver-coated glass filler maintains ESD properties for 15+ years, unaffected by wear or humidity.
  2. Solvent-Free & Low-VOC Safety
    • Zero Hazardous Air Pollutants (HAPs): Eliminates risks of solvent inhalation and explosions in Class 1 Division 2 hazardous zones.
    • OSHA & EPA Compliance: Meets PELs (Permissible Exposure Limits) for worker safety and NESHAP (National Emission Standards) for environmental protection.
    • LEED v4.1 Contribution: Qualifies for IEQ Credit 4.1 (Low-Emitting Materials) and MR Credit 5 (Regional Materials).
  3. Chemical & Abrasion Resistance
    • Solvent Resistance: Immune to  MEK , and PCB flux residues, critical for soldering and rework stations.
    • Taber Abrasion Resistance: <0.015 g loss per 1,000 cycles (ASTM D4060), outperforming standard epoxy by 500%.
  4. High-Gloss & Easy-to-Clean Finish
    • Non-Porous Seamless Surface: Prevents dust accumulation, microbe growth, and liquid penetration, enabling rapid cleaning with IPA wipes or deionized water.
    • Gloss Level: 85-95 GU (60° gloss meter) for enhanced light reflectivity, reducing overhead lighting requirements by 30%.
    • Low-Maintenance: Resists scratches from carts, toolboxes, and foot traffic, maintaining aesthetics without frequent recoating.
  5. Thermal & Humidity Stability
    • Temperature Resistance: Withstands -20°C to +80°C without cracking or delamination, suitable for cold storage or high-heat inspection areas.
    • Humidity Tolerance: Unaffected by 30-90% relative humidity (RH) during curing, preventing blushing or adhesion failure.
    • Thermal Shock Resistance: Endures 50 rapid cycles between -40°C and +120°C (per ASTM C1512), critical for factories with oven curing or freeze testing.

Technical Specifications

 

Parameter Specification
Mixing Ratio Component A : Component B = 4:1 (weight ratio)
Pot Life 40-50 minutes at 25°C (mix and use within 30 minutes)
Recommended DFT 1.5-3 mm per coat (achievable via notched trowel or airless sprayer)
Application Temperature 15-35°C (substrate must be ≥5°C above dew point)
Drying Time Walkable: 10-12 hours; Full cure: 7 days (25°C, 50% RH)
Coverage Rate 0.9-1.1 kg/m² per 1 mm thickness
Shelf Life 18 months when stored at 5-30°C in unopened, UV-protected containers

Electronics Factory Applications

  • Cleanrooms (ISO Class 5-8): Non-shedding, static-dissipative flooring for wafer fabrication, PCB assembly, and medical device manufacturing.
  • SMT (Surface Mount Technology) Lines: Resists solder paste, flux, and cleaning agent spills without corrosion.
  • ESD-Protected Zones: Safeguards ESD-sensitive components (ICs, MOSFETs, LEDs) from static discharge during handling.
  • Chemical Storage Areas: Withstands acids, bases, and solvents used in PCB etching or semiconductor cleaning.
  • Quality Control Labs: Chemical-resistant surface for spill-prone testing stations and failure analysis benches.

Sustainability & Operational Benefits

  • Energy Efficiency: High-gloss finish reduces lighting energy consumption by 25-30%, lowering operational costs.
  • Lifecycle Cost Reduction: 15-20-year lifespan with minimal repairs, cutting maintenance expenses by 60% vs. vinyl or tile.
  • Waste Minimization: Waterborne formulation avoids hazardous waste disposal fees and environmental compliance risks.
  • Worker Safety: Eliminates solvent-related health hazards (headaches, dizziness, respiratory irritation).

Installation Guidelines

  1. Surface Preparation:
    • Diamond-grind concrete to ≥CSP 4 profile; vacuum and solvent-wipe to remove contaminants.
    • Repair cracks with ECC Conductive Epoxy Putty (10-10 Ω resistivity).
    • Apply ECC ESD Primer (10-10 Ω) to ensure uniform conductivity.
  2. Mixing & Application:
    • Mechanically stir Component A for 3 minutes, then add Component B and mix for 2 minutes.
    • Pour onto pre-leveled surface and spread with a notched trowel (6-10 mm teeth) or airless sprayer (15-20 MPa pressure).
  3. Curing & Post-Treatment:
    • Maintain 20-25°C and 40-60% RH for 7 days; avoid foot traffic until surface resistivity stabilizes.
    • Install copper grounding strips at 6 m intervals and connect to building earth per EN 61340-5-1.

Conclusion
The EcoGuard Conductive Shield Waterborne Epoxy Self-Leveling Floor is the gold standard for electronic factories seeking a safe, sustainable, and high-performance flooring solution. Its ESD-safe conductivity, chemical resilience, and low-VOC composition ensure compliance with global electronics standards while protecting sensitive components and worker health. Ideal for cleanrooms, SMT lines, and ESD-protected zones, this coating delivers a flawless, long-lasting surface that enhances productivity and reduces lifecycle costs.

 
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
SPR is a rich experience in industrial building materials research and development and manufacturing enterprises, the company set product research and development, production, sales, technical service, design,plan construction as a whole, from the market itself and the actual needs of customers, special investigation, integration, implementation of integrated process operations, every step of the force.Strive for excellence, strive to provide customers with innovative system solutions and high quality products.

 

The company is located in Nanxiong High-tech Zone, Guangdong Province, covering an area of more than 20,000 square meters, with an annual output of 16,000 tons. In 2022, SPR and Guangdong Jianlang Hardware System Product Co., Ltd. reached a strategic cooperation in the form of equity participation, and set up a joint venture Guangdong Jianlang SPR Construction Engineering Co., LTD., to build the floor industry
Industrial chain one-stop service model.
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories
Hard Waterborne Epoxy Resin Self-Leveling Floor for Electronic FactoriesHard Waterborne Epoxy Resin Self-Leveling Floor for Electronic FactoriesHard Waterborne Epoxy Resin Self-Leveling Floor for Electronic FactoriesHard Waterborne Epoxy Resin Self-Leveling Floor for Electronic Factories

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